Operational RTL Verilog
Logic modules of the Topological Voxel, testbench, and constraint files for technical evaluation.
OKOZAM is structured as a transferable intellectual property package, prepared for technical due diligence, strategic licensing, full acquisition, or industrial co-development.
Technical documentation, protocols, know-how, and validation evidence can be presented under NDA to strategic buyers and qualified industrial partners.
The OKOZAM asset is organized for technical evaluation and technology transfer, with logic components, materials, communication protocols, and master documentation.
Logic modules of the Topological Voxel, testbench, and constraint files for technical evaluation.
Analytical model of the resistive memory substrate based on Hafnium Oxide.
Host interface, packet format, telemetry, and deterministic communication.
Technical specification, failure modes, active redundancy, metrics, and industrial synthesis flow.
Constants, integration criteria, transitional support, and technical guidance during the transfer process.
Final transaction structures are subject to technical due diligence, commercial negotiation, and specific contractual terms.
Irrevocable and exclusive assignment of all intellectual property rights to a single counterparty. Recommended for acquirers seeking strategic exclusivity against competitors.
Exclusive grant limited to defined fields of use, such as pharmaceutical, defense, or hyperscaler, or to specific geographic regions. It allows multiple non-competing counterparties.
Open licensing model analogous to ISA architectures, with royalties per manufactured unit or deployed compute capacity.
Hybrid structure combining limited IP transfer with participation from the originating team during the physical implementation phase, aligning incentives toward commercial success.
Leading companies already possess the manufacturing, packaging, and integration infrastructure. OKOZAM provides the asynchronous 3D In-Memory architecture designed to enable their next generation of products.
OKOZAM is designed for organizations building the next generation of advanced computing infrastructure.
Custom silicon for AI datacenters and advanced simulation.
Architectural differentiation for next-generation accelerators.
New product lines based on heterogeneous integration.
High-value application for 3D-IC, ALD, TSVs, and advanced packaging.
Secure computing, simulation, topological cryptography, and strategic research.
For strategic buyers, industrial partners, or deep-tech investment teams, OKOZAM can be presented under NDA with technical documentation, FPGA validation evidence, and IP transfer structure.
Complete the form and we will prepare the right conversation for NDA, licensing, acquisition, or industrial integration.